SUSPENSION SUBSTRATE, SUSPENSION, SUSPENSION WITH ELEMENT, AND HARD DISC DRIVE

PROBLEM TO BE SOLVED: To provide a suspension substrate which suppresses the deformation or a break of a flying lead terminal.SOLUTION: In a suspension substrate, a metal supporting substrate, a first insulation layer, a first wiring layer, a second insulation layer, and a second wiring layer are di...

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Bibliographische Detailangaben
Hauptverfasser:	MIURA YOICHI, UMEDA KAZUO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a suspension substrate which suppresses the deformation or a break of a flying lead terminal.SOLUTION: In a suspension substrate, a metal supporting substrate, a first insulation layer, a first wiring layer, a second insulation layer, and a second wiring layer are disposed in this order. In an external circuit substrate connection area, a metal supporting substrate opening portion is formed on the metal supporting substrate, and a flying lead terminal which has at least the second wiring layer and connects to the external circuit substrate is formed at the metal supporting substrate opening portion. At an end portion of the metal supporting substrate opening portion, the first wiring layer and the second wring layer are formed so as to be superimposed in a plane view.