PATTERNED CONDUCTIVE ARRAY, AND SELF-LEVELING EPOXY

PROBLEM TO BE SOLVED: To provide a method of assembling a print head having an electrical interconnect layer that is manufactured more easily than conventional assemblies to increase the jet density of a piezoelectric ink jet print head.SOLUTION: A method of forming an ink jet print head can include...

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Hauptverfasser: DOLAN BRYAN R, ANDREWS JOHN R, GERNER BRADLEY J, NYSTROM PETER J
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method of assembling a print head having an electrical interconnect layer that is manufactured more easily than conventional assemblies to increase the jet density of a piezoelectric ink jet print head.SOLUTION: A method of forming an ink jet print head can include a step of attaching multiple piezoelectric elements 20 to a diaphragm 36, a step of dispensing an interstitial layer 50 over the diaphragm, a step of electrically coupling multiple conductive elements 62 to the multiple piezoelectric elements, and a step of curing the interstitial layer. Multiple electrically isolated conductive particles 54 in the interstitial layer electrically couple the multiple conductive elements to the multiple piezoelectric elements. The conductive particles can be evenly distributed throughout the whole of a dielectric of the interstitial layer or can be localized to the top surface of each piezoelectric element and interposed between the multiple piezoelectric elements and the multiple conductive elements. The conductive elements can be part of a flex circuit manifold printed circuit board 60.