POLISHING PAD AND POLISHING METHOD FOR PLATE-LIKE BODY USING THE POLISHING PAD

PROBLEM TO BE SOLVED: To provide a polishing pad and a polishing method that does not cause chipping at the outer periphery of a plate-like body and does not impair the flatness of a polished surface.SOLUTION: The polishing pad is used while being mounted to a rotary body, and has a center of rotati...

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Bibliographische Detailangaben
1. Verfasser:	RI SEIKUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a polishing pad and a polishing method that does not cause chipping at the outer periphery of a plate-like body and does not impair the flatness of a polished surface.SOLUTION: The polishing pad is used while being mounted to a rotary body, and has a center of rotation and an annular polishing surface. The polishing pad is characterized in that the annular polishing surface has a width larger than the diameter of the plate-like body to be polished, and tilts in a direction away from the plate-like body to be polished outward from the center of rotation.