MANUFACTURING METHOD OF PIEZOELECTRIC DEVICE AND THE PIEZOELECTRIC DEVICE MANUFACTURED BY THE MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a manufacturing method which prevents the characteristic deterioration and the lowering of the efficiency percentage of a piezoelectric device in the formation process of an external connection terminal and realizes the versatility of the external connection terminal, and to provide the piezoelectric device manufactured by the manufacturing method.SOLUTION: An electrode structure, which will become an external connection terminal 7A, is provided in advance on a substrate 2A where an element center part 14A is mounted before sealing and packaging a piezoelectric device 1 and a ceiling layer 18A. The electrode structure is sealed and packaged with the ceiling layer 18A after the formation of the element center part 14A. A re-wiring layer may be provided on a main surface of the substrate to deal with a three dimensional structure.