PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE FILM, FORMING METHOD FOR RIB PATTERN, FORMING METHOD FOR HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that is excellent in fine pattern forming properties, has a high elasticity in a cured product, has excellent heat and moisture resistance, and also has excellent hollow-structure maintainability.SOLUTION: A photosensitive resin com...

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Hauptverfasser:	KATO SADAAKI, FUJII SHINJIRO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS RESONATORS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that is excellent in fine pattern forming properties, has a high elasticity in a cured product, has excellent heat and moisture resistance, and also has excellent hollow-structure maintainability.SOLUTION: A photosensitive resin composition comprises a photopolymerisable compound (A) containing a urethane compound (A1) having at least one type of an acryloyl group and a methacryloyl group, and a photopolymerisable initiator (B). In the urethane compound (A1), it is preferable that the total number of acryloyl groups and methacryloyl groups in one molecule is 2-15 and the weight average molecular weight is 950-25000.