PALLADIUM ALLOY SPUTTERING TARGET, AND METHOD FOR PRODUCTION THEREOF

PROBLEM TO BE SOLVED: To provide a Pd alloy sputtering target having a low content of impurities such as oxygen and to provide a method for the production thereof.SOLUTION: The Pd alloy sputtering target contains Pd as the principal component, and 1-60 at%, in total, of at least one selected from am...

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Hauptverfasser:	MIYASHITA TAKASHI, HIGUCHI KIYOSHI, YAGI SHOHEI, GOTO YASUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CASTING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL FERROUS OR NON-FERROUS ALLOYS INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY PERFORMING OPERATIONS PHYSICS POWDER METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WORKING METALLIC POWDER
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a Pd alloy sputtering target having a low content of impurities such as oxygen and to provide a method for the production thereof.SOLUTION: The Pd alloy sputtering target contains Pd as the principal component, and 1-60 at%, in total, of at least one selected from among V, Nb, and Ta, with the balance comprising Pd and unavoidable impurities, and has an oxygen content of 2,000 mass ppm or less based on the entire target. Further, a Pd alloy powder comprising 1-60 at%, in total, of at least one selected from among V, Nb, and Ta with the balance comprising Pd and unavoidable impurities is made by an atomization method, and the obtained Pd alloy powder is heated and molded under pressure to produce the Pd alloy sputtering target.