ADHESIVE TAPE FOR PROCESSING SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER

PROBLEM TO BE SOLVED: To provide an adhesive tape for processing a semiconductor wafer which is excellent in chuck table absorptive properties at the time of grinding, does not break a semiconductor wafer even by thin grinding, and suppresses an amount of warping and an amount of flexure at that tim...

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Bibliographische Detailangaben
1. Verfasser:	OKURA MASATO
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an adhesive tape for processing a semiconductor wafer which is excellent in chuck table absorptive properties at the time of grinding, does not break a semiconductor wafer even by thin grinding, and suppresses an amount of warping and an amount of flexure at that time.SOLUTION: There is provided an adhesive tape for processing a semiconductor wafer, in which an adhesive agent layer is stacked on a base material which is formed of two or more layers including a polyester layer and a polyolefin layer, and the outermost layer of the base material is a polyolefin layer.