MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE

PROBLEM TO BE SOLVED: To control impedance of a through via hole which connects an inner layer and an outer layer of a multilayer substrate.SOLUTION: Between an outer layer pattern and an inner layer pattern which are formed on a conductive layer on one substrate surface, a multilayer substrate incl...

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Bibliographische Detailangaben
1. Verfasser:	SUDO SHUJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To control impedance of a through via hole which connects an inner layer and an outer layer of a multilayer substrate.SOLUTION: Between an outer layer pattern and an inner layer pattern which are formed on a conductive layer on one substrate surface, a multilayer substrate includes; a buried via hole formed in a non-through state to the inner layer pattern and is connected to the ground; a tube-shaped insulator formed in the inside of the buried via hole; and a through via hole which is formed on the tube inner surface of the tube-shaped insulator and at least connects the outer layer pattern and the inner layer pattern.