POSITIVE PHOTOSENSITIVE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition that can give a cured film with high resolution, having low warpage and no pattern embedment by reflow, in the process of low-temperature baking at 200°C or lower.SOLUTION: The positive photosensitive resin composition cont...

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Bibliographische Detailangaben
Hauptverfasser:	TOMIKAWA MASAO, KAMEMOTO SATOSHI, MASUDA YUKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition that can give a cured film with high resolution, having low warpage and no pattern embedment by reflow, in the process of low-temperature baking at 200°C or lower.SOLUTION: The positive photosensitive resin composition contains (a) an alkali-soluble polyimide, (b) at least a compound having two or more epoxy groups in one molecule, and (c) a photoacid generator, in which the content of at least the (b) compound having two or more epoxy groups in one molecule is 10 to 50 parts by weight with respect to 100 parts by weight of the (a) alkali-soluble polyimide.