COPPER-BASED SLIDING MATERIAL
PROBLEM TO BE SOLVED: To provide a copper-based sliding material suppressing coarsening of Bi particles in a Cu alloy layer formed by a continuous sintering process, thereby achieving excellent fatigue resistance and anti-seizing property.SOLUTION: In a copper-based sliding material, Bi, Sn and P ar...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | IMAI TAKUO ZUSHI KOJI TSUJIMOTO KENTARO |
| description | PROBLEM TO BE SOLVED: To provide a copper-based sliding material suppressing coarsening of Bi particles in a Cu alloy layer formed by a continuous sintering process, thereby achieving excellent fatigue resistance and anti-seizing property.SOLUTION: In a copper-based sliding material, Bi, Sn and P are contained in a Cu alloy layer such that a mass ratio Bi/Sn of Bi to Sn is 1.7-3.4 and a mass ratio Bi/P of Bi to P is 500-2,100. Thus, a Cu-Sn-P compound is deposited on a Cu alloy in Cu alloy powder during a cooling process after sintering. Thereby, a difference between thermal shrinkage ratios of the Cu alloy and Bi changed into a liquid phase in the Cu alloy powder is reduced, and the liquid phase of Bi remains in the Cu alloy powder, so that coarsening of Bi particles is suppressed and the Bi particles have an average particle area of 60-350 μmto be dispersed minutely. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2012207277A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2012207277A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2012207277A3</originalsourceid><addsrcrecordid>eNrjZJB19g8IcA3SdXIMdnVRCPbxdPH0c1fwdQxxDfJ09OFhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhkZGBuZG5uaOxkQpAgDGqSFi</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>COPPER-BASED SLIDING MATERIAL</title><source>esp@cenet</source><creator>IMAI TAKUO ; ZUSHI KOJI ; TSUJIMOTO KENTARO</creator><creatorcontrib>IMAI TAKUO ; ZUSHI KOJI ; TSUJIMOTO KENTARO</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a copper-based sliding material suppressing coarsening of Bi particles in a Cu alloy layer formed by a continuous sintering process, thereby achieving excellent fatigue resistance and anti-seizing property.SOLUTION: In a copper-based sliding material, Bi, Sn and P are contained in a Cu alloy layer such that a mass ratio Bi/Sn of Bi to Sn is 1.7-3.4 and a mass ratio Bi/P of Bi to P is 500-2,100. Thus, a Cu-Sn-P compound is deposited on a Cu alloy in Cu alloy powder during a cooling process after sintering. Thereby, a difference between thermal shrinkage ratios of the Cu alloy and Bi changed into a liquid phase in the Cu alloy powder is reduced, and the liquid phase of Bi remains in the Cu alloy powder, so that coarsening of Bi particles is suppressed and the Bi particles have an average particle area of 60-350 μmto be dispersed minutely.</description><language>eng</language><subject>ALLOYS ; CASTING ; CHEMISTRY ; FERROUS OR NON-FERROUS ALLOYS ; MAKING METALLIC POWDER ; MANUFACTURE OF ARTICLES FROM METALLIC POWDER ; METALLURGY ; PERFORMING OPERATIONS ; POWDER METALLURGY ; TRANSPORTING ; TREATMENT OF ALLOYS OR NON-FERROUS METALS ; WORKING METALLIC POWDER</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20121025&DB=EPODOC&CC=JP&NR=2012207277A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20121025&DB=EPODOC&CC=JP&NR=2012207277A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IMAI TAKUO</creatorcontrib><creatorcontrib>ZUSHI KOJI</creatorcontrib><creatorcontrib>TSUJIMOTO KENTARO</creatorcontrib><title>COPPER-BASED SLIDING MATERIAL</title><description>PROBLEM TO BE SOLVED: To provide a copper-based sliding material suppressing coarsening of Bi particles in a Cu alloy layer formed by a continuous sintering process, thereby achieving excellent fatigue resistance and anti-seizing property.SOLUTION: In a copper-based sliding material, Bi, Sn and P are contained in a Cu alloy layer such that a mass ratio Bi/Sn of Bi to Sn is 1.7-3.4 and a mass ratio Bi/P of Bi to P is 500-2,100. Thus, a Cu-Sn-P compound is deposited on a Cu alloy in Cu alloy powder during a cooling process after sintering. Thereby, a difference between thermal shrinkage ratios of the Cu alloy and Bi changed into a liquid phase in the Cu alloy powder is reduced, and the liquid phase of Bi remains in the Cu alloy powder, so that coarsening of Bi particles is suppressed and the Bi particles have an average particle area of 60-350 μmto be dispersed minutely.</description><subject>ALLOYS</subject><subject>CASTING</subject><subject>CHEMISTRY</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>MAKING METALLIC POWDER</subject><subject>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>POWDER METALLURGY</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><subject>WORKING METALLIC POWDER</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2012</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB19g8IcA3SdXIMdnVRCPbxdPH0c1fwdQxxDfJ09OFhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhkZGBuZG5uaOxkQpAgDGqSFi</recordid><startdate>20121025</startdate><enddate>20121025</enddate><creator>IMAI TAKUO</creator><creator>ZUSHI KOJI</creator><creator>TSUJIMOTO KENTARO</creator><scope>EVB</scope></search><sort><creationdate>20121025</creationdate><title>COPPER-BASED SLIDING MATERIAL</title><author>IMAI TAKUO ; ZUSHI KOJI ; TSUJIMOTO KENTARO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2012207277A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2012</creationdate><topic>ALLOYS</topic><topic>CASTING</topic><topic>CHEMISTRY</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>MAKING METALLIC POWDER</topic><topic>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>POWDER METALLURGY</topic><topic>TRANSPORTING</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><topic>WORKING METALLIC POWDER</topic><toplevel>online_resources</toplevel><creatorcontrib>IMAI TAKUO</creatorcontrib><creatorcontrib>ZUSHI KOJI</creatorcontrib><creatorcontrib>TSUJIMOTO KENTARO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>IMAI TAKUO</au><au>ZUSHI KOJI</au><au>TSUJIMOTO KENTARO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COPPER-BASED SLIDING MATERIAL</title><date>2012-10-25</date><risdate>2012</risdate><abstract>PROBLEM TO BE SOLVED: To provide a copper-based sliding material suppressing coarsening of Bi particles in a Cu alloy layer formed by a continuous sintering process, thereby achieving excellent fatigue resistance and anti-seizing property.SOLUTION: In a copper-based sliding material, Bi, Sn and P are contained in a Cu alloy layer such that a mass ratio Bi/Sn of Bi to Sn is 1.7-3.4 and a mass ratio Bi/P of Bi to P is 500-2,100. Thus, a Cu-Sn-P compound is deposited on a Cu alloy in Cu alloy powder during a cooling process after sintering. Thereby, a difference between thermal shrinkage ratios of the Cu alloy and Bi changed into a liquid phase in the Cu alloy powder is reduced, and the liquid phase of Bi remains in the Cu alloy powder, so that coarsening of Bi particles is suppressed and the Bi particles have an average particle area of 60-350 μmto be dispersed minutely.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JP2012207277A |
| source | esp@cenet |
| subjects | ALLOYS CASTING CHEMISTRY FERROUS OR NON-FERROUS ALLOYS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY PERFORMING OPERATIONS POWDER METALLURGY TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WORKING METALLIC POWDER |
| title | COPPER-BASED SLIDING MATERIAL |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-05T01%3A33%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=IMAI%20TAKUO&rft.date=2012-10-25&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2012207277A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |