COPPER-BASED SLIDING MATERIAL

PROBLEM TO BE SOLVED: To provide a copper-based sliding material suppressing coarsening of Bi particles in a Cu alloy layer formed by a continuous sintering process, thereby achieving excellent fatigue resistance and anti-seizing property.SOLUTION: In a copper-based sliding material, Bi, Sn and P are contained in a Cu alloy layer such that a mass ratio Bi/Sn of Bi to Sn is 1.7-3.4 and a mass ratio Bi/P of Bi to P is 500-2,100. Thus, a Cu-Sn-P compound is deposited on a Cu alloy in Cu alloy powder during a cooling process after sintering. Thereby, a difference between thermal shrinkage ratios of the Cu alloy and Bi changed into a liquid phase in the Cu alloy powder is reduced, and the liquid phase of Bi remains in the Cu alloy powder, so that coarsening of Bi particles is suppressed and the Bi particles have an average particle area of 60-350 μmto be dispersed minutely.