HEATING APPARATUS

PROBLEM TO BE SOLVED: To provide a heating apparatus which can decrease occurrence of substrate warp and reduce an influence of heat losses while being grounded reliably even when a substrate is thinned a great deal to accelerate a temperature change.SOLUTION: A heating apparatus comprises: a conduc...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AKIBA HIRONAGA, KUBOTA KAZUHIKO, HATANAKA TSUTOMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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