HEATING APPARATUS

PROBLEM TO BE SOLVED: To provide a heating apparatus which can decrease occurrence of substrate warp and reduce an influence of heat losses while being grounded reliably even when a substrate is thinned a great deal to accelerate a temperature change.SOLUTION: A heating apparatus comprises: a conductive base plate 2; a faceplate 3 arranged above the base plate 2, on which a wafer is placed; and a grounding member 8 arranged between the base plate 2 and the faceplate 3 to allow the base plate 2 and the faceplate 3 to be electrically conducted with each other. The faceplate 3 comprises: an aluminum substrate with a surface electrically insulated except a conduction portion with the grounding member 8; and a film heater provided on the aluminum substrate for heating the wafer. The conduction portion of the aluminum substrate with the grounding member 8 is provided at a center of the aluminum substrate and a plurality of bent parts 8A-8D are provided along a longer direction of the grounding member 8.