HEATING DEVICE

PROBLEM TO BE SOLVED: To provide a heating device capable of reliably preventing flexion due to the weight of a substrate and warpage due to heat, and changing a temperature for a short time by specially thinning the substrate.SOLUTION: A heating device comprises: a face plate 3 as a substrate that is positioned above a base plate 2, on which a wafer W is located, and that is provided with a film heater heating the wafer W; a column 5 standing between the base plate 2 and the face plate 3 and supporting the face plate 3; and a tension member 7 pulling the face plate 3 toward the base plate. The column 5 and the tension member 7 are provided at a position at which at least a portion of the face plate 3 corresponding to a locating area of the wafer W is supported and pulled. The tension member 7 has: a shaft 71, whose upper end is locked by the face plate 3 and whose bottom end penetrates through the base plate 2; and a coil spring 73 positioned on the base plate 2 side, and energizing a lower end side of the shaft 71 downward.