PARTICLE CAPTURING UNIT, MANUFACTURING METHOD OF PARTICLE CAPTURING UNIT AND SUBSTRATE PROCESSING APPARATUS
PROBLEM TO BE SOLVED: To provide a particle capturing unit in which the exhaust efficiency can be prevented from lowering.SOLUTION: A first trap unit 40a configuring a particle trap unit 40 exposed to a particle P flying space comprises: a first mesh-like layer 44 consisting of multiple first stainl...
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| creator | TOYOIZUMI SHUNSUKE MORIYA TAKESHI TAKAHIRO KATSUYUKI |
| description | PROBLEM TO BE SOLVED: To provide a particle capturing unit in which the exhaust efficiency can be prevented from lowering.SOLUTION: A first trap unit 40a configuring a particle trap unit 40 exposed to a particle P flying space comprises: a first mesh-like layer 44 consisting of multiple first stainless steels 44a; and a second mesh-like layer 45 consisting of multiple second stainless steels 45a. The first stainless steel 44a is thicker than the second stainless steel 45a, and the arrangement density of the first stainless steel 44a in the first mesh-like layer 44 is higher than that of the second stainless steels 45a in the second mesh-like layer 45. The second mesh-like layer 45 is interposed between the first mesh-like layer 44 and the particle P flying space, and the first mesh-like layer 44 and the second mesh-like layer 45 are sintered and bonded to each other. |
| format | Patent |
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The first stainless steel 44a is thicker than the second stainless steel 45a, and the arrangement density of the first stainless steel 44a in the first mesh-like layer 44 is higher than that of the second stainless steels 45a in the second mesh-like layer 45. 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The first stainless steel 44a is thicker than the second stainless steel 45a, and the arrangement density of the first stainless steel 44a in the first mesh-like layer 44 is higher than that of the second stainless steels 45a in the second mesh-like layer 45. The second mesh-like layer 45 is interposed between the first mesh-like layer 44 and the particle P flying space, and the first mesh-like layer 44 and the second mesh-like layer 45 are sintered and bonded to each other.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MECHANICAL ENGINEERING NON-POSITIVE DISPLACEMENT PUMPS POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC FLUIDS SEMICONDUCTOR DEVICES WEAPONS |
| title | PARTICLE CAPTURING UNIT, MANUFACTURING METHOD OF PARTICLE CAPTURING UNIT AND SUBSTRATE PROCESSING APPARATUS |
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