PARTICLE CAPTURING UNIT, MANUFACTURING METHOD OF PARTICLE CAPTURING UNIT AND SUBSTRATE PROCESSING APPARATUS

PARTICLE CAPTURING UNIT, MANUFACTURING METHOD OF PARTICLE CAPTURING UNIT AND SUBSTRATE PROCESSING APPARATUS

PROBLEM TO BE SOLVED: To provide a particle capturing unit in which the exhaust efficiency can be prevented from lowering.SOLUTION: A first trap unit 40a configuring a particle trap unit 40 exposed to a particle P flying space comprises: a first mesh-like layer 44 consisting of multiple first stainl...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TOYOIZUMI SHUNSUKE, MORIYA TAKESHI, TAKAHIRO KATSUYUKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
BLASTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEATING
LIGHTING
MECHANICAL ENGINEERING
NON-POSITIVE DISPLACEMENT PUMPS
POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS
PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
SEMICONDUCTOR DEVICES
WEAPONS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a particle capturing unit in which the exhaust efficiency can be prevented from lowering.SOLUTION: A first trap unit 40a configuring a particle trap unit 40 exposed to a particle P flying space comprises: a first mesh-like layer 44 consisting of multiple first stainless steels 44a; and a second mesh-like layer 45 consisting of multiple second stainless steels 45a. The first stainless steel 44a is thicker than the second stainless steel 45a, and the arrangement density of the first stainless steel 44a in the first mesh-like layer 44 is higher than that of the second stainless steels 45a in the second mesh-like layer 45. The second mesh-like layer 45 is interposed between the first mesh-like layer 44 and the particle P flying space, and the first mesh-like layer 44 and the second mesh-like layer 45 are sintered and bonded to each other.