SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device which forms a conductor for shielding in a resin using a simple manufacturing step.SOLUTION: A manufacturing method of a semiconductor device includes a step of mounting a semiconductor element 20 on a substrate 10 and...

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Hauptverfasser: SEO KAZUFUMI, KAWAOKA YASUNORI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device which forms a conductor for shielding in a resin using a simple manufacturing step.SOLUTION: A manufacturing method of a semiconductor device includes a step of mounting a semiconductor element 20 on a substrate 10 and a step of sealing the semiconductor element 20 with a resin 55 so that a conductor 40 encloses the semiconductor element 20 by sticking a resin sheet 50 containing the conductor 40 having a hole on the substrate 10.