SUBSTRATE PROCESSING APPARATUS

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus in which a high frequency power is applied to a plurality of susceptors loading substrates, respectively, and the substrates are processed by heating the plurality of susceptors by induction heating, and which can ensure a soaking reg...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: TANIUCHI MASAMICHI, MIYASHITA TOMOYASU, HIRANO MAKOTO, ISHII AKINORI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a substrate processing apparatus in which a high frequency power is applied to a plurality of susceptors loading substrates, respectively, and the substrates are processed by heating the plurality of susceptors by induction heating, and which can ensure a soaking region in a lamination direction longer.SOLUTION: A substrate processing apparatus comprises: a susceptor holding member 217 holding a plurality of susceptors 150 in a lamination manner; a container 203 housing the plurality of susceptors; an induction coil 207 provided outside of the container; and a heat insulation member 360 provided outside of the container 203. The container 203 includes a closed part 270 on an upper side and a sidewall part 272. The heat insulation material 360 covers the closed part 270 of the container 203 and a region from the closed part 270 to a part of the sidewall part 272 to extend to between the sidewall part 272 and the induction coil 207.