SUBSTRATE COOLING METHOD AND VACUUM PROCESSING APPARATUS

PROBLEM TO BE SOLVED: To provide a cooling method and a vacuum processing apparatus for cooling a heated substrate more uniformly and promptly.SOLUTION: A substrate cooling method of an embodiment comprises: a step of conveying a substrate heated in a processing chamber capable of maintaining a decompressed state from the processing chamber to a load lock chamber capable of maintaining a decompressed state; a step of causing a guide mechanism provided in the load lock chamber to support a circumference of the substrate conveyed to the load lock chamber; and a step of cooling the substrate by bringing a coolant in proximity to but not into contact with a principal surface of the substrate supported by the guide mechanism until the temperature of the substrate reaches a temperature Tlower than a temperature Tright after the substrate is conveyed into the load lock chamber.