LASER MACHINING METHOD AND ITS PROGRAM

PROBLEM TO BE SOLVED: To provide a laser machining method by which the processing accuracy of a workpiece made of a heat-shrinkable material can be improved.SOLUTION: The method, which processes the workpiece by using laser light, includes: a first processing step of forming a groove by laser light...

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Bibliographische Detailangaben
Hauptverfasser: HARADA TORU, SHIRAI KATSUKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a laser machining method by which the processing accuracy of a workpiece made of a heat-shrinkable material can be improved.SOLUTION: The method, which processes the workpiece by using laser light, includes: a first processing step of forming a groove by laser light irradiated from the laser irradiation apparatus along a virtual target line of the workpiece which is the boundary between a first area remaining after laser machining and a second area to be removed by the laser machining under a first machining condition in which the workpiece is not penetrated; and a second processing step of irradiating the workpiece with the laser light at a position that is closer to the second area than the virtual target line and at least partially overlaps the groove by using the same laser irradiation apparatus as used in the first processing step under a second machining condition in which the workpiece is penetrated.