WAFER RING FEEDING DEVICE AND WAFER RING FEEDING METHOD

PROBLEM TO BE SOLVED: To solve the problem that taking out of a wafer ring is expected to fail if there is a difference between the height of wafer ring and the height of a wafer cassette, and in the recent context of deflection of a wafer because of larger wafer size and thinner wafer, taking out of the wafer ring is expected to fail even if the deflection of wafer is large, and if taking out of the wafer ring fails, in other words, if the wafer ring cannot be taken out, a throughput of mounting becomes longer, and further, wafer ring which cannot be taken out is required to be manually removed by an operator, resulting in increase in the number of work steps.SOLUTION: Before a wafer extractor part takes a wafer ring out of the cassette, a wafer cassette lift part is caused to be vibrated vertically. And then, the wafer extractor part takes the wafer ring out of the wafer cassette part.