SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device allowing prevention of the warpage of a substrate having a rectangle shape in a plan view.SOLUTION: A semiconductor device comprises a substrate 8, nonvolatile semiconductor storage elements 10, and an adhesive portion 31. The substrate has a multilayer structure in which a wiring pattern is formed, and has a rectangle shape in plan view. The nonvolatile semiconductor storage elements 10 are arranged along the longitudinal direction on the surface layer side of the substrate. The adhesive portion fills the space between the nonvolatile semiconductor storage elements and the space between the nonvolatile semiconductor storage elements and the substrate while exposing the first surfaces of the nonvolatile semiconductor storage elements.