DEVICE CONNECTOR

PROBLEM TO BE SOLVED: To provide a device connector that prevents molding of a primary molded component in a tilted state and also prevents voids in a molding resin portion.SOLUTION: A terminal block includes a connector housing 50 that has a plurality of conductive plates 10 connected to device-sid...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TATE TAKUYA, SAKAMOTO SHINICHI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a device connector that prevents molding of a primary molded component in a tilted state and also prevents voids in a molding resin portion.SOLUTION: A terminal block includes a connector housing 50 that has a plurality of conductive plates 10 connected to device-side bus bars provided in a motor, molded integrally therewith. The terminal block has: a primary molded component 60 that is formed by molding the conductive plates 10 integrally with a primary molding portion 61; a metal plate 30 that is mounted and fixed to a motor case; and a secondary molding portion 70 that is molded integrally with the primary molded component 60 and the metal plate 30. The secondary molding portion 70 is molded by a secondary molding die that includes an upper die 90, a lower die 91, and a slide die 92. In the primary molding portion 61 prior to the molding of the secondary molding portion 70, a pair of holding portions 69 and 69 are provided for holding the slide die 92.