PHENOLIC COMPOUND, AND PROCESS FOR PRODUCING THE SAME

PROBLEM TO BE SOLVED: To provide a phenolic compound exhibiting low viscosity at 50°C and low moisture absorption, and exhibiting good mechanical properties when being reacted and cured with an epoxy resin.SOLUTION: The phenolic compound is obtained by reacting phenols, an aromatic aldehyde compound...

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Bibliographische Detailangaben
1. Verfasser:	MITANI NORIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a phenolic compound exhibiting low viscosity at 50°C and low moisture absorption, and exhibiting good mechanical properties when being reacted and cured with an epoxy resin.SOLUTION: The phenolic compound is obtained by reacting phenols, an aromatic aldehyde compound and formaldehyde, wherein the aromatic aldehyde compound is used in 0.1 to 4.0 mol times the formaldehyde, and the viscosity at 50°C of the phenolic compound is 0.01 to 100 Pa s.