METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of preventing a wire-bonding pattern failure to an overhang part.SOLUTION: In the method for manufacturing the semiconductor device according to the present embodiment, a bonding head part comes down toward a...

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Bibliographische Detailangaben
Hauptverfasser:	HONDA TOMOMI, SAIJO JUNICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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