METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of preventing a wire-bonding pattern failure to an overhang part.SOLUTION: In the method for manufacturing the semiconductor device according to the present embodiment, a bonding head part comes down toward a bonding pad of an overhang part and contacts with the bonding pad at a lowering speed and a load equaling to a lowering speed and a load in which the bonding head searches a ground reference position in actual bonding, and the ground reference position is previously obtained. In the actual bonding, the bonding head comes down to the ground reference position for the bonding pad formed on the overhang part hanging from a lower support in a semiconductor chip, and a wire is pushed against and bonded to the bonding pad by a tip of the bonding head.