LEAD FRAME, SEMICONDUCTOR DEVICE USING THE SAME AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To make it possible to reduce damages occurring in a punching process on a suspension lead and inhibit occurrence of chips in an encapsulation resin material and interfacial peeling between the encapsulation resin material and the suspension lead.SOLUTION: A lead frame 1 includes a die pad 2, suspension leads 3 connected with the die pad 2 and a plurality of leads arranged at a distance from the die pad. The suspension lead 3 is provided with a thin-walled part 3A in a region including a boundary portion of a mold region 6A at the time of molding an encapsulation resin material and a cut position 3a of the suspension lead 3.