HEAT-CURABLE SILICONE RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR PACKAGE USING THE SAME

PROBLEM TO BE SOLVED: To provide a heat-curable silicone resin composition for sealing an optical semiconductor excellent in adhesiveness which can be easily cured by heating while suppressing shrinkage due to curing with easy operation.SOLUTION: This heat-curable silicone resin composition for sealing an optical semiconductor includes 100 pts.wt. of a reaction product (I) obtained by condensation reaction of (A) 100 pts.wt. of an organopolysiloxane resin having an RSiOunit (where R is a hydrocarbon group and/or hydroxy group), an SiOunit and a silanol group, and (C) 10-200 pts.wt. of a diorganopolysiloxane whose both terminals of molecular chain are encapsulated with silanol groups and/or alkoxysiloxy groups and having 5-10,000 mPa s viscosity, in the presence of a base; (B) 10-500 pts.wt. of an alkoxysilane oligomer having 5-50 wt.% of an alkoxy group bound to a silicon atom; and (D) a condensation catalyst. The optical semiconductor package uses the silicone resin composition.