METHOD FOR MOLECULAR BONDING OF ELECTRONIC COMPONENTS ONTO POLYMER FILM

PROBLEM TO BE SOLVED: To produce three-dimensional structures where thick and/or thin chips are stacked on integrated element plates already formed, the structures being required by development of microelectronics, miniaturization of electronic components, and increasing complexity of electronic ass...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MOLLARET CHRISTPHE, LEACIOCCIO, HUBERT MORRISSEAU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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