METHOD FOR MOLECULAR BONDING OF ELECTRONIC COMPONENTS ONTO POLYMER FILM

PROBLEM TO BE SOLVED: To produce three-dimensional structures where thick and/or thin chips are stacked on integrated element plates already formed, the structures being required by development of microelectronics, miniaturization of electronic components, and increasing complexity of electronic ass...

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Bibliographische Detailangaben
Hauptverfasser:	MOLLARET CHRISTPHE, LEACIOCCIO, HUBERT MORRISSEAU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To produce three-dimensional structures where thick and/or thin chips are stacked on integrated element plates already formed, the structures being required by development of microelectronics, miniaturization of electronic components, and increasing complexity of electronic assemblies.SOLUTION: The invention relates to a method for molecular bridging of an electronic compound (6) to a polymer (4). According to the invention, the polymer (4) is coated with a bonding layer (5) such as silicon oxide. By the bonding layer (5), problems caused by the presence of hydrocarbons are removed. The method can be used to produce adhesive-free three-dimensional structures.