METHOD FOR MOLECULAR BONDING OF ELECTRONIC COMPONENTS ONTO POLYMER FILM

METHOD FOR MOLECULAR BONDING OF ELECTRONIC COMPONENTS ONTO POLYMER FILM

PROBLEM TO BE SOLVED: To produce three-dimensional structures where thick and/or thin chips are stacked on integrated element plates already formed, the structures being required by development of microelectronics, miniaturization of electronic components, and increasing complexity of electronic ass...

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Hauptverfasser: MOLLARET CHRISTPHE, LEACIOCCIO, HUBERT MORRISSEAU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator MOLLARET CHRISTPHE
LEACIOCCIO
HUBERT MORRISSEAU
description PROBLEM TO BE SOLVED: To produce three-dimensional structures where thick and/or thin chips are stacked on integrated element plates already formed, the structures being required by development of microelectronics, miniaturization of electronic components, and increasing complexity of electronic assemblies.SOLUTION: The invention relates to a method for molecular bridging of an electronic compound (6) to a polymer (4). According to the invention, the polymer (4) is coated with a bonding layer (5) such as silicon oxide. By the bonding layer (5), problems caused by the presence of hydrocarbons are removed. The method can be used to produce adhesive-free three-dimensional structures.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title METHOD FOR MOLECULAR BONDING OF ELECTRONIC COMPONENTS ONTO POLYMER FILM
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