JOINING DEVICE, JOINING SYSTEM, JOINING METHOD, PROGRAM AND COMPUTER STORAGE MEDIUM

PROBLEM TO BE SOLVED: To appropriately and efficiently join substrates with each other while suppressing generation of a void between the substrates.SOLUTION: A joining device includes: an upper chuck 230 for sucking and holding an upper wafer Won a lower surface; and a lower chuck 231 provided belo...

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Bibliographische Detailangaben
Hauptverfasser:	HIROSE KEIZO, KITAHARA SHIGENORI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To appropriately and efficiently join substrates with each other while suppressing generation of a void between the substrates.SOLUTION: A joining device includes: an upper chuck 230 for sucking and holding an upper wafer Won a lower surface; and a lower chuck 231 provided below the upper chuck 230, for mounting, sucking and holding a lower wafer Won an upper surface. The upper chuck 230 is provided with a pushing member 250 for pressurizing a center part of the upper wafer W. On a distal end part on the side of the upper wafer Win a pushing pin 251 of the pushing member 250, a guide member 253 which sucks and holds the upper wafer W, fixes the position in a horizontal direction of the upper wafer Wand is freely movable in a vertical direction is provided. On an outer peripheral part of the lower chuck 231, a stopper member 262 for the wafers Wand Wand a piled wafer Wis provided.