SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor device including a semiconductor structure called SOI, which is less likely to be restricted in circuit design to set a lower surface of a semiconductor substrate of the semiconductor structure to ground potential.SOLUTION: A semiconductor device comprises a multilayer printed board 12 and a semiconductor structure 31 called SOI mounted in a recess 15 provided on the side of a lower surface of the multilayer printed board 12 in a face-up manner. Further, the semiconductor structure 31 is mounted on a printed wiring board 1 by connection of a center part of a lower surface of a semiconductor substrate 33 with ground wiring 3 of the printed wiring board 1 via a conductive adhesive layer 43 arranged below the lower surface of the semiconductor substrate 33. In this case, it is almost unnecessary to regard a routing line for ground. Accordingly, it becomes possible to cause the semiconductor device to be less likely to be restricted in circuit design to set the lower surface of the semiconductor substrate 33 of the semiconductor structure 31 to ground potential.