HEAT RADIATOR WITH JOINT FACE, AND SURFACE TREATMENT METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a heat radiator, which is formed of a metallic material, which has improved adhesiveness to resin without excessively roughening its surface, and in which deterioration of a thermal performance together with improvement of adhesiveness is restrained.SOLUTION: A heat...

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Bibliographische Detailangaben
Hauptverfasser:	KIYOOKA FUMITOSHI, KOSAKABE TOMOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a heat radiator, which is formed of a metallic material, which has improved adhesiveness to resin without excessively roughening its surface, and in which deterioration of a thermal performance together with improvement of adhesiveness is restrained.SOLUTION: A heat radiator 1 contacts an electronic component 6 energized to generate heat in a heat transferring manner, and radiates or diffuses the heats. The heat radiator comprises a joint face 3 jointed on a substrate 5, on which the electronic component 6 is arranged, via adhesive 4. The joint face 3 comprises a lower layer, in which indentations and projections are formed; and an upper layer, in which nickel crystal particles with a diameter of 0.5-1.0 μm are formed on the lower layer.