VEHICLE BUMPER, AND MOLDING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a vehicle bumper and a molding method thereof capable of thinning a thickness and reducing weight by suppressing the generation of a weld line caused by injection molding.SOLUTION: The vehicle bumper includes a molding fitting groove 4 over the bumper side 3 from the...

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Bibliographische Detailangaben
Hauptverfasser:	OTSUBO TAKENOBU, WAKAMATSU KAZUNORI, SEKIGUCHI ATSUSHI, NAKAGAKI HITOSHI, TAKATSU RYOICHI, KAMAE KOSUKE, SHIMIZU MASAYOSHI, KUGAYA TAKUJI, ASHIDA TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING VEHICLES IN GENERAL VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISEPROVIDED FOR WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a vehicle bumper and a molding method thereof capable of thinning a thickness and reducing weight by suppressing the generation of a weld line caused by injection molding.SOLUTION: The vehicle bumper includes a molding fitting groove 4 over the bumper side 3 from the bumper center 2, and its groove bottom is formed with a fastening hole 5 for pressing in and fitting a clip 7 of a side molding 6. In the injection molding of a rear bumper 1, a plate thickness Tc of the bumper center 2 in which gates G-Gare concentrated is reduced, and the generation of the weld line can be suppressed by increasing a meeting angle of a molten resin around a movable core of forming the fastening hole 5 by molding in the different plate thickness distribution of increasing a plate thickness Ts of the bumper side 3.