PACKAGE CARRIER AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a package carrier suitable for carrying a heat-generating element and a manufacturing method of the package carrier.SOLUTION: A manufacturing method of a package carrier is provided. A first opening that communicates an upper surface and a lower surface of a substrat...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: SON SEO HO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a package carrier suitable for carrying a heat-generating element and a manufacturing method of the package carrier.SOLUTION: A manufacturing method of a package carrier is provided. A first opening that communicates an upper surface and a lower surface of a substrate is formed. A heat-conducting element having a top surface and a bottom surface is disposed in the first opening and fixed into the first opening through an insulation material. A first insulation layer and a first metal layer are laminated onto the upper surface. A second insulation layer and a second metal layer are laminated onto the lower surface. A second opening and a third opening, each of which exposes a portion of the top surface and the bottom surface, are formed. At least one through via that penetrates the first metal layer, the first insulation layer, the substrate, the second insulation layer, and the second metal layer is formed. A third metal layer that covers the first metal layer, the second metal layer, and an inner wall of the through via is formed.