LAMINATE FOR FORMING WIRING BOARD, WIRING BOARD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a laminate for forming a wiring board, which allows a wiring board having excellent thermal conductivity to be formed and has excellent processability, and to provide a wiring board manufactured using the same, and a method for manufacturing a semiconductor device.SO...

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Hauptverfasser:	MATSUURA YOSHITSUGU, OBATA KAZUHITO, DOBASHI AKIHIKO, INADA TEIICHI, NISHIMURA MASATO, YASU KATSUHIKO, OYAMA YASUSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a laminate for forming a wiring board, which allows a wiring board having excellent thermal conductivity to be formed and has excellent processability, and to provide a wiring board manufactured using the same, and a method for manufacturing a semiconductor device.SOLUTION: A laminate for forming a wiring board is configured to include: a wiring board material in which a first metal layer for circuit formation, an insulating layer, and a second metal layer are laminated in this order; an adhesive layer provided on the second metal layer of the wiring board material; and a separator provided on the adhesive layer and having a heat-resistant resin layer.