HIGH CONDUCTIVITY PRINTED WIRING BOARD, AND METHOD OF MANUFACTURING SAME

PROBLEM TO BE SOLVED: To provide a high conductivity printed wiring board, along with its manufacturing method, in which, firstly a large cross section area of a conductor is available, secondary it is excellent in high frequency characteristic for improved efficiency, thirdly miniaturizing is possible, and fourthly these are easily realized at a lower cost.SOLUTION: The high conductivity printed wiring board 1, having a hollow conductor structure, at least includes a copper foil pattern 4 that is patterned on the outer surface of an insulating substrate 2, a conductor coat 9 which covers the copper foil pattern 4, and a foam hollow layer 7 formed between the copper foil pattern 4 and the conductor coat 9. A conductor part 10 is formed of the copper foil pattern 4 and the conductor coat 9. In a representative example, the foam hollow layer 7 is formed by forming a foaming agent 5 such as foaming ink, and the conductor coat 9 comprises a solder coat.