PIEZOELECTRIC DEVICE AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a piezoelectric device which reduces a short circuit between conductive adhesives coated on a pair of piezoelectric oscillation element mounting pads.SOLUTION: A piezoelectric device of the present invention comprises: a substrate part; an element mounting member pro...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: IBUSUKI KATSUHIDE, YOKOYAMA YUTAKA
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a piezoelectric device which reduces a short circuit between conductive adhesives coated on a pair of piezoelectric oscillation element mounting pads.SOLUTION: A piezoelectric device of the present invention comprises: a substrate part; an element mounting member provided with a first frame part and a second frame on one principal surface of the substrate part and formed of a recess space; a pair of piezoelectric oscillation element mounting pads provided in the recess space; a tuning-fork type flexural crystal oscillation element mounted on the pair of piezoelectric oscillation element mounting pads, and including a base part, two oscillation arm parts extending from lateral faces of the base part in the same direction, and balancing arm parts extending from the lateral faces of the base part located between the two oscillation arm parts; a lid hermetically sealing the recess space; and a groove provided between the piezoelectric oscillation element mounting pads on a principal surface of the first frame part. A relationship between a length W1 in a depth direction of the groove and a thickness W2 of the first frame part is represented as 0.4≤W1/W2≤0.9.