MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To obtain a manufacturing method of a semiconductor device which easily eliminates resin burrs and suppresses electric discharge between terminals of a lead frame.SOLUTION: A lead frame 1 having a package external region 5 and a package internal region 6 is used. A burr surface 7 is provided at an upper end of a side surface of the lead frame 1 and a breaking surface 8 is provided near the upper end of the side surface. The upper end of the side surface of the lead frame 1 is chamfered in the package external region 5. A semiconductor element 10 is mounted on the lead frame 1 and is sealed with a mold resin 12 in the package internal region 6. After the chamfering process and the resin sealing, resin burrs 13 provided on the side surface of the lead frame 1 are eliminated in the package external region 5.