METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device in which a concentration of an impurity metal remained in wiring is low.SOLUTION: This manufacturing method includes the steps of: forming an insulation film on a semiconductor substrate; forming a recess part in the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NASU HAYATO, WATABE TADAYOSHI, USUI TAKAMASA
Format: Patent
Sprache:eng
Schlagworte:
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