CIRCUIT BOARD, AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a technique by which a solder paste supplied to an electrode pad can be increased while suppressing the increase in the thickness of a protection film formed on a surface of a circuit board, and protecting the surface of the circuit board by the protection film.SOLUT...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATSUI AKIKO, YAMADA TETSUO, SUGANE MITSUHIKO, MUKOUYAMA NARUHIDE, HIROSHIMA YOSHIYUKI, OI YOSHIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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