CIRCUIT BOARD, AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a technique by which a solder paste supplied to an electrode pad can be increased while suppressing the increase in the thickness of a protection film formed on a surface of a circuit board, and protecting the surface of the circuit board by the protection film.SOLUT...

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Bibliographische Detailangaben
Hauptverfasser:	MATSUI AKIKO, YAMADA TETSUO, SUGANE MITSUHIKO, MUKOUYAMA NARUHIDE, HIROSHIMA YOSHIYUKI, OI YOSHIHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a technique by which a solder paste supplied to an electrode pad can be increased while suppressing the increase in the thickness of a protection film formed on a surface of a circuit board, and protecting the surface of the circuit board by the protection film.SOLUTION: The circuit board has a surface protection film formed on a surface thereof except at least an electrode pad region on which an electronic component is mounted by soldering connection. The surface protection film is composed of multiple layers, and has an aperture area of the electrode pad region which becomes larger from the bottom layer toward the top layer.