WATER-SOLUBLE RESIN COMPOSITION AND METHOD OF FORMING FINE PATTERNS USING THE SAME

PROBLEM TO BE SOLVED: To provide a water-soluble resin composition for forming fine photoresist patterns by efficiently reducing the size of a contact hole pattern of a photoresist in a semiconductor process.SOLUTION: The water-soluble resin composition comprises a water-soluble polymer represented...

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Bibliographische Detailangaben
Hauptverfasser:	PARK SANG WOOK, PARK SO-JUN, SEO DONGUL
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a water-soluble resin composition for forming fine photoresist patterns by efficiently reducing the size of a contact hole pattern of a photoresist in a semiconductor process.SOLUTION: The water-soluble resin composition comprises a water-soluble polymer represented by (Formula 1) as specified, and a first water-soluble solvent, and is coated and heat-treated on a photoresist layer having a contact hole pattern formed, to reduce the size of the contact hole.