CHEMICAL PALLADIUM/GOLD PLATING FILM STRUCTURE, METHOD FOR PRODUCTION THEREOF, PALLADIUM/GOLD PLATING FILM PACKAGE STRUCTURE BONDED WITH COPPER WIRE OR PALLADIUM/COPPER WIRE, AND PACKAGING PROCESS THEREOF

PROBLEM TO BE SOLVED: To provide a chemical palladium/gold plating film structure, a method for the production thereof, a palladium/gold plating film package structure bonded with a copper wire or a palladium/copper wire, and a packaging process thereof.SOLUTION: The chemical palladium/gold plating...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU KUANNG, CHIU KUO-PIN, LIN MING-HUNG, LI YIN-JIE, KUO TASI-TUNG
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!