CHEMICAL PALLADIUM/GOLD PLATING FILM STRUCTURE, METHOD FOR PRODUCTION THEREOF, PALLADIUM/GOLD PLATING FILM PACKAGE STRUCTURE BONDED WITH COPPER WIRE OR PALLADIUM/COPPER WIRE, AND PACKAGING PROCESS THEREOF

PROBLEM TO BE SOLVED: To provide a chemical palladium/gold plating film structure, a method for the production thereof, a palladium/gold plating film package structure bonded with a copper wire or a palladium/copper wire, and a packaging process thereof.SOLUTION: The chemical palladium/gold plating...

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Bibliographische Detailangaben
Hauptverfasser:	LIU KUANNG, CHIU KUO-PIN, LIN MING-HUNG, LI YIN-JIE, KUO TASI-TUNG
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a chemical palladium/gold plating film structure, a method for the production thereof, a palladium/gold plating film package structure bonded with a copper wire or a palladium/copper wire, and a packaging process thereof.SOLUTION: The chemical palladium/gold plating film is situated on a solder pad and comprises a palladium plating layer situated on the solder pad and a gold plating layer situated on the palladium plating layer. The chemical palladium/gold plating film and the copper wire and the palladium/copper wire which are bonded to the gold plating layer by wire bonding form a package structure. This invention also provides a method for producing the chemical palladium/gold plating film and a packaging process for the package structure. In this invention, the palladium plating layer is used instead of a conventional nickel layer, so that the bonding strength of wire bonding between the copper wire or the copper palladium wire and the solder pad can be improved.