METHOD FOR MANUFACTURING Sn ALLOY BUMP
PROBLEM TO BE SOLVED: To provide a method for manufacturing a Sn alloy bump in which the composition of the Sn alloy bump can be easily controlled.SOLUTION: The method for manufacturing a Sn alloy bump formed of an alloy composed of Sn and other one or more kinds of metals includes: a step of formin...
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| creator | MASUDA AKIHIRO HATTA KENJI |
| description | PROBLEM TO BE SOLVED: To provide a method for manufacturing a Sn alloy bump in which the composition of the Sn alloy bump can be easily controlled.SOLUTION: The method for manufacturing a Sn alloy bump formed of an alloy composed of Sn and other one or more kinds of metals includes: a step of forming a Sn layer 4a by electrolytic plating on an electrode pad 3 in a resist opening 2a, the electrode pad being formed on a substrate 1; a step of laminating Sn and an alloy layer 4b by electrolytic plating on the Sn layer 4a; and a step of forming a Sn alloy bump 5 by melting the Sn layer 4a and the laminated alloy layer 4b after removing a resist 2. |
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a step of laminating Sn and an alloy layer 4b by electrolytic plating on the Sn layer 4a; and a step of forming a Sn alloy bump 5 by melting the Sn layer 4a and the laminated alloy layer 4b after removing a resist 2.</description><language>eng</language><subject>APPARATUS THEREFOR ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SEMICONDUCTOR DEVICES</subject><creationdate>2012</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120816&DB=EPODOC&CC=JP&NR=2012153939A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120816&DB=EPODOC&CC=JP&NR=2012153939A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MASUDA AKIHIRO</creatorcontrib><creatorcontrib>HATTA KENJI</creatorcontrib><title>METHOD FOR MANUFACTURING Sn ALLOY BUMP</title><description>PROBLEM TO BE SOLVED: To provide a method for manufacturing a Sn alloy bump in which the composition of the Sn alloy bump can be easily controlled.SOLUTION: The method for manufacturing a Sn alloy bump formed of an alloy composed of Sn and other one or more kinds of metals includes: a step of forming a Sn layer 4a by electrolytic plating on an electrode pad 3 in a resist opening 2a, the electrode pad being formed on a substrate 1; 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| subjects | APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES |
| title | METHOD FOR MANUFACTURING Sn ALLOY BUMP |
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