METHOD FOR MANUFACTURING Sn ALLOY BUMP

PROBLEM TO BE SOLVED: To provide a method for manufacturing a Sn alloy bump in which the composition of the Sn alloy bump can be easily controlled.SOLUTION: The method for manufacturing a Sn alloy bump formed of an alloy composed of Sn and other one or more kinds of metals includes: a step of formin...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MASUDA AKIHIRO, HATTA KENJI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for manufacturing a Sn alloy bump in which the composition of the Sn alloy bump can be easily controlled.SOLUTION: The method for manufacturing a Sn alloy bump formed of an alloy composed of Sn and other one or more kinds of metals includes: a step of forming a Sn layer 4a by electrolytic plating on an electrode pad 3 in a resist opening 2a, the electrode pad being formed on a substrate 1; a step of laminating Sn and an alloy layer 4b by electrolytic plating on the Sn layer 4a; and a step of forming a Sn alloy bump 5 by melting the Sn layer 4a and the laminated alloy layer 4b after removing a resist 2.