APPARATUS AND METHOD FOR ULTRASONIC BONDING

PROBLEM TO BE SOLVED: To prevent burr from being produced when bonding, with ultrasonic waves Y, an object to be bonded larger than the area of a horn.SOLUTION: In an ultrasonic vibration device including the horn and an fixed base, and for vibrating the object to be bonded in a single vibration dir...

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Bibliographische Detailangaben
Hauptverfasser: YONEDA YUTAKA, SHIGE KAZUYOSHI, HAYASHI KENICHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To prevent burr from being produced when bonding, with ultrasonic waves Y, an object to be bonded larger than the area of a horn.SOLUTION: In an ultrasonic vibration device including the horn and an fixed base, and for vibrating the object to be bonded in a single vibration direction relative to a substrate where the horn is placed on the fixed base, the horn includes: a horn base 1 having a pressurizing surface 10 for pressurizing the object to be bonded, and vibrating in the vibration direction; a plurality of first grooves provided along a first direction included in the pressurizing surface; a plurality of second grooves provided along a second direction included in the pressurizing surface; protrusions 4 provided on the pressurizing surface between the first grooves and the second grooves; and plane surfaces 5 provided at lease at both ends of the pressurizing surface in the vibration direction, and having a plane surface having a height lower than the tip of the protrusions and higher than the first grooves and the second grooves.