PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To provide a package carrier suitable for mounting a heat generation element, and a method for manufacturing the package carrier.SOLUTION: A substrate 110a is provided, and a first opening 115a communicated with an upper surface 111a and a lower surface 113a is formed. A heat c...

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Bibliographische Detailangaben
1. Verfasser:	SON SEO HO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a package carrier suitable for mounting a heat generation element, and a method for manufacturing the package carrier.SOLUTION: A substrate 110a is provided, and a first opening 115a communicated with an upper surface 111a and a lower surface 113a is formed. A heat conducting element 120 is arranged in the first opening 115a, and fixed in the first opening 115a by an insulating material 130. A through hole 117a penetrating through the substrate 110a is formed. A metal layer 140 is formed on the upper surface 111a and lower surface 113a of the substrate 110a and inside the through hole 117a, so as to coat the upper surface 111a and the lower surface 113a of the substrate 110a, the heat conducting element 120 and the insulating material 130. A part of the metal layer 140 is removed. A solder mask 150 is formed on the metal layer. A surface protection layer 160 is formed to coat the metal layer 140 exposed by the solder mask 150 and the metal layer 140 positioned in the through hole 117a.